- By Application
- By Material
- By Type
- Ceramic Package Lids
- Communication Modules
- Ceramic Quad Flat Pack (CQFP)
- Eyelet Power Packages
- Flip Chip Packaging and Assembly
- GaN & SiC Packages
- MMIC Packages
- Optoelectronic Components
- Organic Semiconductor Packages
- Power Transistor Packages
- Transmit / Receive Modules
Eyelet Power Packages
Kyocera International offers a wide variety of hermetic ceramic-eyelet packages that are a more reliable alternative than glass-to-metal sealed packages. These packages have excellent thermal properties due to metal alloy heat sinks that can include a brazed BeO insert â€” isolating the case if needed. All packages meet MIL-STD and space qualifications.
Many common designs such as TO-254, TO-257, and TO-258 are open tooled and available with quick turn around, or we can help design a custom package. We also have low resistance, Cu alloy pin designs for voltage drops of 25 - 30% of glass-to-metal style pins.
Applications for ceramic-eyelet packages primarily include hi-rel, space, and telecommunications.