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Semiconductor Components » Packaging » By Type » Eyelet Power Packages
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Eyelet Power Packages

Kyocera International offers a wide variety of hermetic ceramic-eyelet packages that are a more reliable alternative than glass-to-metal sealed packages. These packages have excellent thermal properties due to metal alloy heat sinks that can include a brazed BeO insert — isolating the case if needed. All packages meet MIL-STD and space qualifications.

Many common designs such as TO-254, TO-257, and TO-258 are open tooled and available with quick turn around, or we can help design a custom package. We also have low resistance, Cu alloy pin designs for voltage drops of 25 - 30% of glass-to-metal style pins.

Applications for ceramic-eyelet packages primarily include hi-rel, space, and telecommunications.

Semiparts Eyelet Power