Packaging » By Type » LDMOS


LDMOS (Laterally Diffused Metal Oxide Semiconductor) packages are used in applications in the 500 MHz to 3.5 GHz frequency range which are typically found in cellular / digital base stations, HDTV transmitters, and avionic applications. With over 20 years of LDMOS package manufacturing, Kyocera America can quickly and easily modify an existing design or develop a new design based on your specific application.

Kyocera's LDMOS packages offer excellent thermal characteristics due to advanced flange design and materials. These packages are well suited for today's demanding power applications as device temperatures increase and linearity requirements become more stringent.

LDMOS packages are ideal for GaN and SiC devices using open-tooled or modified package outlines. KAI has low cost manufacturing capacity to meet your volume requirements on existing or new designs.

With many years in the RF industry Kyocera America has the ability to provide cost effective, high volume and excellent quality LDMOS packages for any power transistor application.

Semipart LDMOS

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